The protection of electronics, sensors, microsystems or implantable devices against physicochemical influences from the environment represents a major challenge. Coat-X, a Swiss company founded in the Canton of Neuchâtel, has developed an encapsulation technology using ultrathin multilayers which is unique worldwide for its excellent hermeticity and minimal volume while keeping costs at a competitive level.
In addition to the packaging of conventional electronics, this technology allows the creation of flexible circuits with a high protection against corrosion. The multilayer packaging technology allows to meet the most demanding specifications of form factor, performance and costs in e.g. medical devices industries (implants), aerospace (high-tech sensors), watch industry (long-term protection), wearable devices (smart and flexible, IoT) and pharmaceutical applications (long-term protection). Coat-X proposes exclusive costumer solutions which are adapted to the product needs.
In addition, Coat-X disposes of its own developed test benches to verify, validate and certify the performance of its multilayer coatings concerning hermeticity.
Encapsulation, Packaging, Multilayer, Silicon Dioxide, Parylene, Corrosion Protection, Barrier Layer, Thin-film Coating, Water Tightness, Surface Activation, Plasma Treatment, Electronic PCB, Ultra-flexible PCB, Sensor and Actuator Protection, Smart Wearable Devices, IoT, Biocompatibility, Implantable devices, Permeation and Helium Leak Test